Paper Conference

Proceedings of eSim 2014: 8th Conference of IBPSA-Canada


Optimization of a Thermodiode Panel (TDP) Sizes by Employing Genetic Algorithm (GA)

M. Ebrahim Poulad, Alan Fung, Meijian Li

Abstract: A Generic Algorithm (GA) code is developed to optimize the sizes of the TDP for Toronto weather conditions to gain maximum solar thermal energy on an annual basis. GA codes are written in Matlab for five main sizes of the TDP components: front, middle and back aluminum plate thicknesses, thermosyphon outer diameter and its thickness. Thermosyphon is constructed from copper tube, which passes through the adiabatic layer of the TDP to transfer heat from outside (evaporator) to inside (condenser). The plate thicknesses are found to be 3mm, 3mm, and 1mm and thermosyphon diameter and thickness of 25mm and 10mm, respectively. The TDP optimal dimensions are then checked for mechanical stability using SolidWorks. The resulting maximum strain is found less than 0.01% due to combined thermal and mechanical stress, which makes the reliable structure.
Pages: 616 - 628